MIL-HDBK-115B(ARMY) APPENDIX D
IPR IPR IPR
FUNCTIONAL/ECONOMIC ANALYSIS 5.2
DISASSEMBLY PROCUEDURES
5.12
REVERSE ENGINEERING MANAGEMENT PLAN 5.19
Data Collection
Alternate Data Sources Screening of Required Documentation Candidate File
Data Evaluation
Missing Data Required Hardware Required Test Requirements Revue Engineering Cost-Estimate
and Schedules
Initial Inspection and Testing
Physical Configuration
Audit (PCA)
Initial Measurements
Disassembl
Parts Identification
TDP
Tasking Plan
HARDWARE ANALYSIS
5.20
LEVEL 3 DRAWINGS
5.25
QUALITY CONTROL
5.27
Dimensional Analysis |
Producibility |
Quality Assurance Provisions |
|
Material Analysis |
Value Engineering |
(QAPs) |
|
Electrical-Electronic Analysis Engineering Sketches and |
Product Improvement |
Documentation Quality Control |
IPR
PROTOTYPE PRODUCTION
5.36
FINALIZE TDP
5.43
Estimates Make-or- Buy Schedules
Procurement
Fabrication
Inspection and Quality Control
Assembly
Test
Certificate of Compliance
FIGURE 1: The reverse engineering process (see 5.1).
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