MIL-HDBK-115 Us Army Reverse Engineering Handbook Guidelines And ProceduresThis HANDBOOK, which provides the guidelines and procedures for performing reverse engineering, was created using current applicable laws and knowledge gained during a trial program from July 1985 to April 1987, and is based on experiences obtained from military and industry participants. This handbook is for guidance only and cannot be cited as a requirement.

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MIL-HDBK-115B(ARMY)

(10) Power consumption (max/min), and

(11) Specialized functional parameters, b. Digital circuit designs should be checked for:

(1) Input/output level (with and without stimuli), (2) Proper bias levels,

(3) Rise and fall time of signaling pulses, (4) Clock frequency and duty cycle,

(5) Circuit interaction and component characteristics, (6) Thermal characteristics,

(7) Input/output impedances,

(8) Functional parameters of circuitry/effects of fault simulation, (9) Power consumption of circuitry (max/min), and

(10) Specialized functional parameters.

5.23.6 Environmental requirements. Environmental requirements should be thoroughly documented and tested for shock, vibration, temperature, humidity and any EMI/RFI (electro-magnetic interference/radio frequency interference) requirement.

5.23.7 Performance characteristics. In conjunction with the above circuit analysis and design validation, component performance characteristics should be examined to guarantee that input/output parameters can be realized to meet the specifications and reliability requirements of the candidate. All specifications and component characteristics should be included in the parts list and/or appropriate drawings.

5.24 Engineering sketches and specifications.

5.24.1 Engineering sketches and specifications objective. Engineering sketches and specifications developed at this time may be used to draft the Level 3 drawings, control drawings, and other technical documents required for the preliminary TDP.