MIL-HDBK-115B(ARMY)
c. Circuit parameters and characteristics, circuit path checks, input/output parameters, special functions, wave form analysis, and layering and bonding requirements,
d. Enclosure requirements, such as pressure and leakage allowances, (MIL-E-2036 may be used as a guide.)
e. Liquid penetrant inspections and personnel certifications, (SAE AMS2644 and NAS 410 may be used as guides.)
f. Magnetic particle inspections and personnel certifications, (ASTM E1444 and NAS 410 may be used as guides.)
g. Radiographic inspections, (SAE AMS2175, MIL-HDBK-1264, MIL-HDBK-1265, and ASTM E1742/ASTM E1742M may be used as guidance.) and
h. A review of interchangeable, moving and mating parts to ensure proper dimensions of close fitted items. ANSI B4.1 may be used as a guide.
5.26.3 Drawing maintenance. All drawings and specifications should be revised as required to reflect any changes or corrections resulting from the producibility study. Upon completion of this update all documentation should be placed in the candidate file for use in the production of Level 3 drawings.
5.27 Quality control (QC).
5.27.1 QC study. A quality control study should be performed and documented on the Level 3 drawings and prototype of candidates to certify their compliance with original candidate specifications.
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5.27.2 QC plan. A quality control plan should be developed to ensure the product conforms to drawings, specifications, inspections, tests, and task order requirements.
5.27.3. QC inspections. Quality control inspections should be applied to the procurement of supplies and services, as follows:
a. Engineering service contracts where software/documentation deliverables are necessary, and
b. Minor limited production or prototype hardware contracts where inspection is the major quality control factor.
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