MIL-HDBK-115B(ARMY)
PARAGARAPH PAGE
5.8.3 Data evaluation considerations............. 13
5.8.4 Data call sheet..................14
5.9 Hardware required.................... 14
5.10 Test requirements..................... 14
5.10.1 Initial inspection................. 14
5.10.2 Test plan objective................. 14
5.10.3 Worse-case analysis..................15
5.11 Reverse engineering cost-estimate and schedule.......15
5.11.1 Review....................... 15
5.11.2 Development....................15
5.11.3 Sample cost-estimate................... 15
5.11.4 Prototype values................. 15
5.11.5 Dollar values.................... 15
5.12 Disassembly procedures................. 15
5.13 Initial inspection and testing............. 16
5.13.1 Post-shipment inspection............... 16
5.13.2 Pre-disassembly photographs............ 16
5.14 Physical configuration audit (PCA).............. 16
5.14.1 Formal examination................. 16
5.14.2 Hardware/documentation comparison.......... 16
5.15 Initial measurements................... 16
5.16 Disassembly.................... 17
5.16.1 Record keeping.................. 17
5.16.2 Parts control.................... 17
5.16.3 Terminal/pin markings................ 17
5.16.4 Inseparable assemblies................ 17
5.17 Parts identification/screening............... 17
5.17.1 Identification................... 17
5.17.2 Economic analysis................ 17
5.17.3 Document research................ 18
5.17.4 Master Cross-Reference List (MCRL).......... 18
5.17.5 Government-Industry Data Exchange Program (GIDEP).. 18
5.17.5.1 Identify sources...................18
5.17.5.2 GIDEP representatives/membership.......... 19
5.17.5.3 Additional sources of data.............. 19
5.18 Technical data package requirements......... 19
5.19 Reverse engineering management plan............ 19
5.19.1 Reverse engineering management plan objective......19
5.19.2 Management plan development............ 19
5.19.3 Tasking plan.....................19
5.19.4 Program Evaluation and Review Technique (PERT) Chart.. 20
5.19.5 Identify lead times................. 20
5.20 Hardware analysis.................... 20
5.20.1 Hardware analysis objective.............. 20
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